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  • What are the characteristics and applications of thermal con
What are the characteristics and applications of thermal con
Thermal conductive double-sided tape is made of high performance pressure sensitive adhesive filled with high thermal conductivity ceramic particles coated on both sides of glass fiber cloth or withou
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产品简介 / Introduction

What are the characteristics and applications of thermal con · 基本信息

Thermal conductive double-sided tape is made of high performance pressure sensitive adhesive filled with high thermal conductivity ceramic particles coated on both sides of glass fiber cloth or without substrate.


Thermal conductive double-sided tape provides efficient heat conduction channels between electronic devices and radiators, so that there is no need for mechanical fixing and solidification of liquid adhesives between electronic devices and radiators.


What are the characteristics and applications of thermal conductive double-sided tape?


Thermal conductive double-sided tape is made of high performance pressure sensitive adhesive filled with high thermal conductivity ceramic particles coated on both sides of glass fiber cloth or without substrate.


Thermal conductive double-sided tape provides efficient heat conduction channels between electronic devices and radiators, so that there is no need for mechanical fixing and solidification of liquid adhesives between electronic devices and radiators.


Characteristic:


When using thermal conductive double-sided tape, it needs only light pressure to bond immediately; its bonding performance and bonding strength increase with time and temperature.

Thermal conductive double-sided tape can be die-cut in any shape, and can be pre-pasted on a surface for future bonding use.


Application:

Thermal conductive double-sided tape is used to bond chips, flexible circuit boards, high-power transistors, radiators or other cooling devices. Such as:

Bonding and Installation of High Power LED Aluminum Substrate and Radiator

Install elastic heating sheet

Installation of Temperature Display Film

Installation of Thermoelectric Cooling Die

Bonding of Radiator to Microprocessor

Bonding of Flexible Circuit to Heat Dissipator

Bonding of Power Transistor to Printed Circuit Board

产品物理指标及技术参数

宽度
长度
厚度
基材
适用范围

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